Fischer Electronik Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik WLFT 404 46 X 46

Description
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES
Datasheet
Description
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik - 35M4072 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik
35M4072
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik 35M4072
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES

THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M.K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 35M4072
Product Name Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik
Thermal Conductivity 0.3700 W/m-K (0.2138 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Ultra Low Thermal Resistance One Part Epoxy System - Supreme 18TC - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® AD13-9692B - MacDermid Alpha Electronics Solutions
Specs
Type Optical
Cure / Technology Single Component
Form / Shape Liquid; Grease, Paste
View Details
Thermal gel for cpu - SE40 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details