Fischer Electronik Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik WLFT 404 43 X 43

Description
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES
  • Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik - 35M4071 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik - 35M4071 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik
35M4071
Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik 35M4071
THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M .K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES

THERMALLY CONDUCTIVE FOIL, ADHESIVE; INSULATOR BODY MATERIAL:NYLON (POLYAMIDE), (POLYIMIDE FILM MT); THERMAL CONDUCTIVITY:0.37W/M.K; BREAKDOWN VOLTAGE VBR:-; THICKNESS:0.127MM; VOLUME RESISTIVITY:-; THERMAL IMPEDANCE:-; DIELECTRIC ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 35M4071
Product Name Thermally Conductive Foil, Adhesive; Insulator Body Material Fischer Elektronik
Thermal Conductivity 0.3700 W/m-K (0.2138 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Thermal Pads - 1745699 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
1745699
Specs
Chemical System Silicone
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® AD13-9521B - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Precision Camera Module Adhesive Solutions
ALPHA ® HiTech ® AD13-9521B
Specs
Cure / Technology Single Component
Form / Shape Liquid
Industry Electronics; Semiconductors, IC's
View Details