Fischer Electronik Gap Filler, Gel Foil, 1.5 W/m K, 3Mm; Insulator Body Material Fischer Elektronik GEL30

Description
GAP FILLER, GEL FOIL, 1.5 W/M K, 3MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes
Datasheet
Description
GAP FILLER, GEL FOIL, 1.5 W/M K, 3MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, Gel Foil, 1.5 W/m K, 3Mm; Insulator Body Material Fischer Elektronik - 65W5609 - Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, Gel Foil, 1.5 W/m K, 3Mm; Insulator Body Material Fischer Elektronik
65W5609
Gap Filler, Gel Foil, 1.5 W/m K, 3Mm; Insulator Body Material Fischer Elektronik 65W5609
GAP FILLER, GEL FOIL, 1.5 W/M K, 3MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes

GAP FILLER, GEL FOIL, 1.5 W/M K, 3MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m.K; Breakdown Voltage Vbr:-; Thickness:3mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 65W5609
Product Name Gap Filler, Gel Foil, 1.5 W/m K, 3Mm; Insulator Body Material Fischer Elektronik
Thermal Conductivity 1.5 W/m-K (0.8667 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
ALPHA ® Argomax ® 2020 Paste -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Form / Shape Die Bonding Adhesives; Grease, Paste
Industry Automotive; Electronics; Semiconductors, IC's
View Details
Thermally Conductive, Low Viscosity Epoxy - EP30AO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details