MARTIN Solder Pellets for BGA reballing are designed for precise soldering applications. These pellets have a diameter of 0.25 mm and a melting point of 220 ¬8C, making them suitable for various reballing processes. Each package contains 50,000 lead-free solder balls composed of a SnAgCu alloy (Sn 96.5%, Ag 3.0%, Cu 0.5%), ensuring compliance with RoHS standards. The pellets are stored in an inert Argon atmosphere to prevent oxidation, which can adversely affect soldering performance. The storage life of unopened boxes is 12 months, while opened boxes can be used for up to 6 months. This product is ideal for engineers looking for reliable soldering solutions in BGA rework applications.
Solder Pellets, for BGA Reballing, 0.25 mm, 220 C, 3 g RoHS Compliant: Yes
| Newark, An Avnet Company | |
|---|---|
| Product Category | Welding, Brazing, and Soldering Equipment |
| Product Number | 06X9694 |
| Product Name | Solder Pellets, For Bga Reballing, 0.25 Mm, 220 C, 3 G Rohs Compliant Martin Smt |
PE, PP, PVDF, ECTFE
