Extreme Engineering Solutions, Inc. (X-ES) Dual XMC/PMC Carrier for Development and Testing

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Dual XMC/PMC Carrier for Development and Testing
The XTend3103 is a dual XMC/PMC carrier card that offers a compact, low-cost development platform for XMC/PMC modules. In conjunction with a standard off-the-shelf ATX power supply, the XTend3103 provides a complete desktop or benchtop PCI/PCI-X XMC and PMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis. The XTend3103 features four integrated 40 mm fans arranged in a push-pull configuration to provide ample airflow for even the most power-hungry modules (up to 50 W each). The XTend3103 also provides onboard +5 V, +3.3 V, and -12 V power supplies, sourcing only +12 V from the ATX power supply. This arrangement avoids the voltage drop and ampacity problems commonly associated with powering high-performance mezzanine modules using ATX supplies. Another common problem with XMC/PMC development is lack of early access to rear I/O ports. This is especially troublesome with conduction-cooled modules, which by design do not have Ethernet or serial access via front panel connectors. The XTend3103 solves this problem by providing a XIM/PIM (XMC/PMC I/O module) site for each XMC/PMC. These sites, when used in conjunction with the appropriate XIM/PIM, can provide the necessary I/O during the early development stage, when custom backplanes and wiring harnesses are often not available.

The XTend3103 is a dual XMC/PMC carrier card that offers a compact, low-cost development platform for XMC/PMC modules. In conjunction with a standard off-the-shelf ATX power supply, the XTend3103 provides a complete desktop or benchtop PCI/PCI-X XMC and PMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis.
The XTend3103 features four integrated 40 mm fans arranged in a push-pull configuration to provide ample airflow for even the most power-hungry modules (up to 50 W each). The XTend3103 also provides onboard +5 V, +3.3 V, and -12 V power supplies, sourcing only +12 V from the ATX power supply. This arrangement avoids the voltage drop and ampacity problems commonly associated with powering high-performance mezzanine modules using ATX supplies.
Another common problem with XMC/PMC development is lack of early access to rear I/O ports. This is especially troublesome with conduction-cooled modules, which by design do not have Ethernet or serial access via front panel connectors. The XTend3103 solves this problem by providing a XIM/PIM (XMC/PMC I/O module) site for each XMC/PMC. These sites, when used in conjunction with the appropriate XIM/PIM, can provide the necessary I/O during the early development stage, when custom backplanes and wiring harnesses are often not available.

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  Extreme Engineering Solutions, Inc. (X-ES)
Product Category Industrial Chassis and Card Cages
Product Name Dual XMC/PMC Carrier for Development and Testing
CPU Slot Two
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