The EM032LXQADG13IS1R is a 32Mbit STT-MRAM memory device from Quarktwin Technology Ltd., featuring an xSPI serial interface that supports multiple I/O configurations including Octal, Quad, Dual, and Single SPI protocols. It operates at a clock frequency of up to 200 MHz, allowing for high-speed data transfer rates of up to 400MBps for both reads and writes. This memory device is designed for applications requiring high data integrity, as it does not require external ECC and supports unlimited read and write operations. It is JEDEC compliant and offers byte-level read and write capabilities without the need for erase cycles in persistent memory mode. The EM032LXQADG13IS1R is available in RoHS compliant packages, including a 24-ball BGA and an 8-pin DFN, and operates within a temperature range of -40¬8C to +85¬8C for industrial applications. This product is suitable for a variety of applications, including Industrial IoT, process automation, FPGA configuration, and medical devices, making it a versatile choice for engineers looking for reliable and high-performance memory solutions.
IC RAM 32MBIT XSPI/QUAD 8DFN
IC RAM 32MBIT XSPI/QUAD 8DFN
MRAM (Magnetoresistive RAM) Memory IC 32Mbit SPI - Octal I/O 200 MHz 8-DFN (6x8)
| DigiKey | Acme Chip Technology Co., Limited | Quarktwin Technology Ltd. | |
|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 819-EM032LXQADG13IS1RTR-ND | EM032LXQADG13IS1R | EM032LXQADG13IS1R |
| Product Name | Memory | Integrated Circuits (ICs) - Memory - Memory | Memory |
| Memory Category | MRAM | Non-Volatile | RAM |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | |
| Density | 32000 kbits | 32000 kbits | 32000 kbits |