TECAPAI CM XP530 is a compression molded polyamide-imide material that is modified with 30% glass fiber filler. Produced using Solvay Torlon® plastic polymer, TECAPAI CM XP530 delivers a unique combination of properties and may be recognized as products commonly referred to in web searches as "torlon 5530". Machining Torlon requires experience. One of the distinctive characteristics of this glass filled PAI is improved machinability when compared to other PAI compression molded materials. Micro machining with fewer burs left behind than competitive materials is possible. TECAPAI CM XP530 has high strength and stiffness at elevated temperatures, a low CLTE, good dielectric properties, and excellent compressive strength, in addition to excellent chemical resistance. Typical applications include test sockets in the semiconductor industry, as well as electrical connectors and insulators. Users in aerospace might be interested in this versatile PAI plastic for fasteners and housings, or for other structural components. Minimum order quantities as low as 1 piece adds to the versatility of this PAI product.
Facts
Chemical designation: PAI (Polyamide-imide)
Color: black
Density: 1,61 g/cm3
Main Features
electrically insulating
excellent strength and stiffness
excellent dimensional stability
very good thermal stability
excellent chemical resistance
Target industries
semiconductor technology
aircraft and aerospace technology
oil and gas industry
chemical and refinery industry
process engineering
TECAPAI CM XP530 is a compression molded polyamide-imide material that is modified with 30% glass fiber filler. Produced using Solvay Torlon® plastic polymer, TECAPAI CM XP530 delivers a unique combination of properties and may be recognized as products commonly referred to in web searches as "torlon 5530". Machining Torlon requires experience. One of the distinctive characteristics of this glass filled PAI is improved machinability when compared to other PAI compression molded materials. Micro machining with fewer burs left behind than competitive materials is possible. TECAPAI CM XP530 has high strength and stiffness at elevated temperatures, a low CLTE, good dielectric properties, and excellent compressive strength, in addition to excellent chemical resistance. Typical applications include test sockets in the semiconductor industry, as well as electrical connectors and insulators. Users in aerospace might be interested in this versatile PAI plastic for fasteners and housings, or for other structural components. Minimum order quantities as low as 1 piece adds to the versatility of this PAI product.
Facts
- Chemical designation: PAI (Polyamide-imide)
- Color: black
- Density: 1,61 g/cm3
Main Features
- electrically insulating
- excellent strength and stiffness
- excellent dimensional stability
- very good thermal stability
- excellent chemical resistance
Target industries
- semiconductor technology
- aircraft and aerospace technology
- oil and gas industry
- chemical and refinery industry
- process engineering
