The 12R1 platform is a lighter version of the 12R2 platform and is used for rugged applications with weight restrictions and less stringent shock and vibration requirements. The modular 12R1 platforms range from 2U to 10U height with horizontal and vertical board orientations. The all-aluminum shell design consists of extrusion and sheet metal, joint together with stainless steel screws. The chemical conversion coating provides corrosion protection and electrical conductivity. Custom paint finishes are also available. A hinged front panel ensures unobstructed access to boards and drives. Located on the rear is a large patch panel for I/O connection. Exceptional front-to-rear cooling is achieved by a rear evacuative cooling system employing high CFM blowers. Additional fans may be installed under the card cage in applications with high impedence boards. To meet IP53 (spray water) according to IEC 60529, louved air intake and exhaust openings are available upon request.
Features
VME/VME64x, VXS, VPX and CPCI compatible
Ideal for airborne applications where weight is a premium
20-25% less weight than comparable rugged chassis
2U-10U heights, horizontal or vertical card orientation options
Complete EMC integrity via braided gasketing and honeycomb filtering, blind-riveting design
Rugged chassis shell made of aluminum frames and extruded profiles
350-1400 watt power supplies
90 - 264 V AC input, 47 - 500 Hz with optional 28V/48V DC input
Wide range of backplane options 2-20 slots
Compliant to IEEE 1101.10/.11 mechanical specifications
Configurable IO patch panel on rear
Rear mounted fans (pull-configuration) standard
Standard voltage and system monitoring LEDs
Shelf management option
Tested for shock, vibration, and structural integrity
Withstands 15 G’s 11ms (shock and vibration resistance)
Custom configurations available
The 12R1 platform is a lighter version of the 12R2 platform and is used for rugged applications with weight restrictions and less stringent shock and vibration requirements. The modular 12R1 platforms range from 2U to 10U height with horizontal and vertical board orientations. The all-aluminum shell design consists of extrusion and sheet metal, joint together with stainless steel screws. The chemical conversion coating provides corrosion protection and electrical conductivity. Custom paint finishes are also available. A hinged front panel ensures unobstructed access to boards and drives. Located on the rear is a large patch panel for I/O connection. Exceptional front-to-rear cooling is achieved by a rear evacuative cooling system employing high CFM blowers. Additional fans may be installed under the card cage in applications with high impedence boards. To meet IP53 (spray water) according to IEC 60529, louved air intake and exhaust openings are available upon request.
Features
- VME/VME64x, VXS, VPX and CPCI compatible
- Ideal for airborne applications where weight is a premium
- 20-25% less weight than comparable rugged chassis
- 2U-10U heights, horizontal or vertical card orientation options
- Complete EMC integrity via braided gasketing and honeycomb filtering, blind-riveting design
- Rugged chassis shell made of aluminum frames and extruded profiles
- 350-1400 watt power supplies
- 90 - 264 V AC input, 47 - 500 Hz with optional 28V/48V DC input
- Wide range of backplane options 2-20 slots
- Compliant to IEEE 1101.10/.11 mechanical specifications
- Configurable IO patch panel on rear
- Rear mounted fans (pull-configuration) standard
- Standard voltage and system monitoring LEDs
- Shelf management option
- Tested for shock, vibration, and structural integrity
- Withstands 15 G’s 11ms (shock and vibration resistance)
- Custom configurations available
