ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling properties. 0.75 gal Pail.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | EP1330 GL |
| Product Name | ResinLab EP1330 Epoxy Adhesive Black 0.75 gal Pail |
| Cure / Technology | Single Component |
| Chemical System | Epoxy |
| Substrate Compatibility | Metal; Plastic |
| Viscosity | 475000 cP |
