Electrolube Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube HTSP830G

Description
THERMAL COMPOUND, 830G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:830g; Product Range:HTSP Series RoHS Compliant: Yes
  • Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube - 26AK8134 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL COMPOUND, 830G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:830g; Product Range:HTSP Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube - 26AK8134 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube
26AK8134
Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube 26AK8134
THERMAL COMPOUND, 830G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:830g; Product Range:HTSP Series RoHS Compliant: Yes

THERMAL COMPOUND, 830G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:830g; Product Range:HTSP Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 26AK8134
Product Name Thermal Compound, 830G, Cartridge; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® HiTech ® AD13-9521B - - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
ALPHA ® HiTech ® AD13-9521B
Specs
Cure / Technology Single Component
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed
SE3000
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details