Electrolube Heat Transfer Paste, 35Ml, Syringe; Dispensing Method Electrolube HTCX35SL

Description
HEAT TRANSFER PASTE, 35ML, SYRINGE; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
HEAT TRANSFER PASTE, 35ML, SYRINGE; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Paste, 35Ml, Syringe; Dispensing Method Electrolube - 44AC2394 - Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Paste, 35Ml, Syringe; Dispensing Method Electrolube
44AC2394
Heat Transfer Paste, 35Ml, Syringe; Dispensing Method Electrolube 44AC2394
HEAT TRANSFER PASTE, 35ML, SYRINGE; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

HEAT TRANSFER PASTE, 35ML, SYRINGE; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 44AC2394
Product Name Heat Transfer Paste, 35Ml, Syringe; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal conductive non-silicone gap filler thermal pad for heatsink - AF500 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details