Electrolube Thermal Compound, 700G, Cartridge; Dispensing Method Electrolube HTCPX700G

Description
THERMAL COMPOUND, 700G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:HTCPX Series RoHS Compliant: Yes
Datasheet
Description
THERMAL COMPOUND, 700G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:HTCPX Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Compound, 700G, Cartridge; Dispensing Method Electrolube - 26AK8135 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Compound, 700G, Cartridge; Dispensing Method Electrolube
26AK8135
Thermal Compound, 700G, Cartridge; Dispensing Method Electrolube 26AK8135
THERMAL COMPOUND, 700G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:HTCPX Series RoHS Compliant: Yes

THERMAL COMPOUND, 700G, CARTRIDGE; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:HTCPX Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 26AK8135
Product Name Thermal Compound, 700G, Cartridge; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Thermal Pads - 2457311 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1600 W/m-K (924 BTU-ft/hr-ft²-F)
View Details
Thermally Conductive Epoxy Polysulfide Adhesive - EP21TPFL-1AO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details