Electrolube Heat Transfer Compound, Syringe, 35Ml; Dispensing Method Electrolube HTC35SL

Description
HEAT TRANSFER COMPOUND, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
HEAT TRANSFER COMPOUND, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Compound, Syringe, 35Ml; Dispensing Method Electrolube - 57AC5815 - Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Compound, Syringe, 35Ml; Dispensing Method Electrolube
57AC5815
Heat Transfer Compound, Syringe, 35Ml; Dispensing Method Electrolube 57AC5815
HEAT TRANSFER COMPOUND, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

HEAT TRANSFER COMPOUND, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 57AC5815
Product Name Heat Transfer Compound, Syringe, 35Ml; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal gel for cpu - SE40 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details