Electrolube Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube EHTS01K

Description
HEAT TRANSFER COMPOUND, CONTAINER, 1KG; Dispensing Method:Container; Volume:-; Weight:1kg; Product Range:HTS Series RoHS Compliant: Yes
  • Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube - 78AH1192 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
HEAT TRANSFER COMPOUND, CONTAINER, 1KG; Dispensing Method:Container; Volume:-; Weight:1kg; Product Range:HTS Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube - 78AH1192 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube
78AH1192
Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube 78AH1192
HEAT TRANSFER COMPOUND, CONTAINER, 1KG; Dispensing Method:Container; Volume:-; Weight:1kg; Product Range:HTS Series RoHS Compliant: Yes

HEAT TRANSFER COMPOUND, CONTAINER, 1KG; Dispensing Method:Container; Volume:-; Weight:1kg; Product Range:HTS Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 78AH1192
Product Name Heat Transfer Compound, Container, 1Kg; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
SnapTrace®
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Thermal Pads - 1745713 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
1745713
Specs
Chemical System Silicone
View Details
Non-Drip, Polysulfide Based Two Component Adhesive - EP21TPND-NV - Master Bond, Inc.
Master Bond, Inc.
Non-Drip, Polysulfide Based Two Component Adhesive
EP21TPND-NV
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details