Allied Electronics, Inc. GLOWCORE 2.5% NO CLEAN FLUX CORE SOLDER, SNC100C, .050 70054274

Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering
Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

Suppliers

Company
Product
Description
Supplier Links
GLOWCORE 2.5% NO CLEAN FLUX CORE SOLDER, SNC100C, .050 - 70054274 - Allied Electronics, Inc.
Fort Worth, TX, USA
GLOWCORE 2.5% NO CLEAN FLUX CORE SOLDER, SNC100C, .050
70054274
GLOWCORE 2.5% NO CLEAN FLUX CORE SOLDER, SNC100C, .050 70054274
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features:

  • Does Not Contain Silver or Bismuth
  • Eutectic Alloy
  • Bridge-Free and Icicle-Free Soldering
  • Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate
  • Good Through-Hole Penetration
  • Good Topside Fillet Formation
  • Dross Rate Equal or Lower Than Tin-Lead Solder
  • Does Not Require a Nitrogen Atmosphere
  • Does Not Erode Copper from Holes, Pads and Tracks
  • Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath
  • Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys
  • Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead
  • Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface
  • Also, Performs Well in Selective and Dip Soldering
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Filler Alloys and Consumables
Product Number 70054274
Product Name GLOWCORE 2.5% NO CLEAN FLUX CORE SOLDER, SNC100C, .050
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 555254 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0138 inch (0.3500 mm)
Melting Range 423 F (217 C)
View Details
ALPHA ® Vaculoy Solid Solder -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Welding Consumables -  - Linde North America, Inc.
Linde North America, Inc.
View Details
Low Alloy Electrodes - S148044-035 - Hobart Brothers, an ITW Company
Hobart Brothers, an ITW Company
Specs
Joining Process / Product Form Flux coated stick or electrode for welding or brazing.
Diameter / Thickness 0.1250 inch (3.17 mm)
Welding Filler Types Steel - Low Alloy Carbon
View Details