Allied Electronics, Inc. FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SNC100C, LEAD FREE, .050 70054264

Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering
Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

Suppliers

Company
Product
Description
Supplier Links
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SNC100C, LEAD FREE, .050 - 70054264 - Allied Electronics, Inc.
Fort Worth, TX, USA
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SNC100C, LEAD FREE, .050
70054264
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SNC100C, LEAD FREE, .050 70054264
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features:

  • Does Not Contain Silver or Bismuth
  • Eutectic Alloy
  • Bridge-Free and Icicle-Free Soldering
  • Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate
  • Good Through-Hole Penetration
  • Good Topside Fillet Formation
  • Dross Rate Equal or Lower Than Tin-Lead Solder
  • Does Not Require a Nitrogen Atmosphere
  • Does Not Erode Copper from Holes, Pads and Tracks
  • Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath
  • Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys
  • Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead
  • Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface
  • Also, Performs Well in Selective and Dip Soldering
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Filler Alloys and Consumables
Product Number 70054264
Product Name FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SNC100C, LEAD FREE, .050
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 1796671 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
ALPHA ® Telecore Plus Cored Wire -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Flux Cored Wire
View Details
Nickel Pre-Cut Tabs -  - Sunstone Engineering
Sunstone Engineering
Specs
Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.
Welding Filler Types Nickel Alloy
View Details
Welding Consumables -  - Linde North America, Inc.
Linde North America, Inc.
View Details