Allied Electronics, Inc. FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SAC305, LEAD FREE, .020 70054256

Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering
Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

Suppliers

Company
Product
Description
Supplier Links
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SAC305, LEAD FREE, .020 - 70054256 - Allied Electronics, Inc.
Fort Worth, TX, USA
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SAC305, LEAD FREE, .020
70054256
FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SAC305, LEAD FREE, .020 70054256
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features:

  • Does Not Contain Silver or Bismuth
  • Eutectic Alloy
  • Bridge-Free and Icicle-Free Soldering
  • Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate
  • Good Through-Hole Penetration
  • Good Topside Fillet Formation
  • Dross Rate Equal or Lower Than Tin-Lead Solder
  • Does Not Require a Nitrogen Atmosphere
  • Does Not Erode Copper from Holes, Pads and Tracks
  • Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath
  • Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys
  • Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead
  • Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface
  • Also, Performs Well in Selective and Dip Soldering
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Filler Alloys and Consumables
Product Number 70054256
Product Name FASTCORE 2.5% ACTIVATED ROSIN SOLDER, SAC305, LEAD FREE, .020
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 6246634 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0394 inch (1 mm)
Melting Range 441 F (227 C)
View Details
ALPHA ® EF-6808HF Liquid Soldering Flux -  - MacDermid Alpha Electronics Solutions
Specs
Fluxes & Cleaners Soldering Flux / Rosin
View Details
EFD Solder Paste -  - Nordson EFD
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
Approvals / Conformance ISO9001
View Details
Rope Hardfacing Flexible Cord - Grade N Tuf-Cote® - Saint-Gobain Coating Solutions
Specs
Joining Process / Product Form A multi-layered preform for brazing carbide or joining materials with compatibility issues.
Braze Alloy Nickel Alloy Braze; Tungsten Carbide
View Details