RS Components, Ltd. 555248

Description
No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Percent Lead = 36% Product Form = Paste Melting Point = +179°C Percent Silver = 2% Percent Tin = 62% Flux Type = Resin Product Weight = 30g
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 - 555248 - RS Components, Ltd.
Corby, Northants, United Kingdom
No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Percent Lead = 36% Product Form = Paste Melting Point = +179°C Percent Silver = 2% Percent Tin = 62% Flux Type = Resin Product Weight = 30g

No-Clean solder paste suitable for stencil printing in reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free.
Percent Lead = 36%
Product Form = Paste
Melting Point = +179°C
Percent Silver = 2%
Percent Tin = 62%
Flux Type = Resin
Product Weight = 30g

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Technical Specifications

  RS Components, Ltd.
Product Category Filler Alloys and Consumables
Product Number 555248
Joining Process / Product Form Braze or solder in the form of a paste.
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