Sn62Pb36Ag2 alloy, solder with low melting point. In contrast with other alloys, already solidus at 179 °C â useful for repairs to manufactured PCBs. Thanks to careful temperature control, heat damage can be reduced to a minimum. Extraordinary wetting and flow capabilities. Silver content prevents leaching out when welding silver-plated surfaces, as well as preventing brittling, making for significantly more stable welds . Filling weight of 2.5%, HF version 3.5% Wire Diameter = 0.5mm Percent Lead = 36% Product Form = Wire Melting Point = +179°C Percent Silver = 2% Percent Tin = 62% Flux Type = Halide Activated Rosin Product Weight = 250g Flux Content Percent = 3.5%