RS Components, Ltd. 1991474

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 - 1991474 - RS Components, Ltd.
Corby, Northants, United Kingdom
A flexible but tough potting compound which adheres to most surfaces.The materials low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C, ,0.25 hours @100°C Product Material = PUR Package Type = Pack Package Size = 350 g Special Properties = Water Resistance Cure Time = 24 h Hardness = 60 Shore A Thermal Conductivity = 0.25W/mK Colour = Amber Maximum Operating Temperature = +120°C Minimum Operating Temperature = -50°C

A flexible but tough potting compound which adheres to most surfaces.The materials low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C, ,0.25 hours @100°C
Product Material = PUR
Package Type = Pack
Package Size = 350 g
Special Properties = Water Resistance
Cure Time = 24 h
Hardness = 60 Shore A
Thermal Conductivity = 0.25W/mK
Colour = Amber
Maximum Operating Temperature = +120°C
Minimum Operating Temperature = -50°C

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Technical Specifications

  RS Components, Ltd.
Product Category Encapsulants and Potting Compounds
Product Number 1991474
Use Temperature -58 to 248 F (-50 to 120 C)
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