A flexible but tough potting compound which adheres to most surfaces.The materials low viscosity enables fine reproduction, good penetration and fast air removal before curing., Ideal for delicate electronic components requiring protection with flexibility and restraint.Vacuum degassing during cure will further reduce entrapped air. Handling represents minimal contact hazard.,Cure time: 24 hours @25°C, ,0.25 hours @100°C
Product Material = PUR
Package Type = Pack
Package Size = 350 g
Special Properties = Water Resistance
Cure Time = 24 h
Hardness = 60 Shore A
Thermal Conductivity = 0.25W/mK
Colour = Amber
Maximum Operating Temperature = +120°C
Minimum Operating Temperature = -50°C
| RS Components, Ltd. | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | 1991474 |
| Use Temperature | -58 to 248 F (-50 to 120 C) |
