RS Components, Ltd. 195978

Cure time: 8//24 hours @ 25°C. The compound can be handled after 8 hours but full properties are developed after 24 hours. Cured material can be easily removed from broken or defective units. Clarity of the material allows the defect to be spotted without stripping the whole unit. Ideal for encapsulation of PCBs and delicate units where the components are to be protected from mechanical or thermal shock. Low water absorption and moisture sensitivity during cure. Low penetrating viscosity. Excellent low temperature flexibility to -60°C. Low encapsulation stress. Excellent electrical properties Product Material = PUR Package Type = Pack Package Size = 250 g Special Properties = Low Penetrating Viscosity Cure Time = 24 h Hardness = 12 Shore A Thermal Conductivity = 0.2W/mK Colour = Transparent Yellow Maximum Operating Temperature = +100°C Minimum Operating Temperature = -60°C