CPU Support : Intel® Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts Overclocking
CPU Socket : 2011 (Square Type, 80 x 80mm mounting pitch)
Solution : Low-noise Ø92x25 PWM fan, HCC(Heatpipe Contact CPU) technology heatpipe CPU cooler with pre-printed Shin-Etsu G751 Thermal Compoundfor 3U Server & Up, Workstation & Tower Desktop
| Dynatron Corp. | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | R17 |
| Product Name | Server CPU Coolers |
| Device | Active Heat Sink |
| L | 91 mm (3.58 inch) |
| W | 91 mm (3.58 inch) |
| H | 110 mm (4.33 inch) |
| Weight | 530 g (18.7 oz) |
