Dow Chemical Company (The) Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail 4116483

Description
Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail.
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Description
Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail.
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Suppliers

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Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail - EG-3810 DIELECTRIC GEL 18KG PAIL - Ellsworth Adhesives
Germantown, WI, USA
Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail
EG-3810 DIELECTRIC GEL 18KG PAIL
Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail EG-3810 DIELECTRIC GEL 18KG PAIL
Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail.

Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low viscosity, and no mixing needed. 18 kg Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Sealants
Product Number EG-3810 DIELECTRIC GEL 18KG PAIL
Product Name Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail
Cure / Technology Single Component
Chemical System Silicone
Features High Dielectric; Encapsulant, Potting Compound
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