Dow Chemical Company (The) Dow SE 9187 L Silicone Conformal Coating Black 330 mL Cartridge 4116009

Description
Dow SE 9187 L Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for general potting, LED and LCD module assembly. It is flowable, tack free, very low viscosity, flame resistance, and has controlled silicone volatility. 330 mL Cartridge.
Request a Quote Datasheet
Description
Dow SE 9187 L Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for general potting, LED and LCD module assembly. It is flowable, tack free, very low viscosity, flame resistance, and has controlled silicone volatility. 330 mL Cartridge.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Dow SE 9187 L Silicone Conformal Coating Black 330 mL Cartridge - SE 9187 L BLACK 330ML - Ellsworth Adhesives
Germantown, WI, USA
Dow SE 9187 L Silicone Conformal Coating Black 330 mL Cartridge
SE 9187 L BLACK 330ML
Dow SE 9187 L Silicone Conformal Coating Black 330 mL Cartridge SE 9187 L BLACK 330ML
Dow SE 9187 L Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for general potting, LED and LCD module assembly. It is flowable, tack free, very low viscosity, flame resistance, and has controlled silicone volatility. 330 mL Cartridge.

Dow SE 9187 L Adhesive Black is a one component, room temperature curing, silicone adhesive that is used for general potting, LED and LCD module assembly. It is flowable, tack free, very low viscosity, flame resistance, and has controlled silicone volatility. 330 mL Cartridge.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number SE 9187 L BLACK 330ML
Product Name Dow SE 9187 L Silicone Conformal Coating Black 330 mL Cartridge
Cure / Technology Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Formulations - Applications - Bonding - Mine Bonder 2000 - 3200060 - Hernon Manufacturing, Inc.
Specs
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermally Conductive, Dimensionally Stable Epoxy - EP121AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Filled
View Details
ADMER™ Adhesive Resin -  - Mitsui Chemicals America, Inc.
Mitsui Chemicals America, Inc.
View Details