Dow Chemical Company (The) Dow SILASTIC™ RTV-3120 Base Red 453 g Jar 4107663

Description
Dow SILASTIC™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar.
Request a Quote Datasheet
Description
Dow SILASTIC™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Dow SILASTIC™ RTV-3120 Base Red 453 g Jar - RTV-3120 BASE 453G BKT - Ellsworth Adhesives
Germantown, WI, USA
Dow SILASTIC™ RTV-3120 Base Red 453 g Jar
RTV-3120 BASE 453G BKT
Dow SILASTIC™ RTV-3120 Base Red 453 g Jar RTV-3120 BASE 453G BKT
Dow SILASTIC™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar.

Dow SILASTIC™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Sealants
Product Number RTV-3120 BASE 453G BKT
Product Name Dow SILASTIC™ RTV-3120 Base Red 453 g Jar
Cure / Technology Two Component  
Chemical System Silicone; Elastomeric
Industry Tooling
Viscosity 13000 to 40000 cP
Unlock Full Specs
to access all available technical data

Similar Products

Liquid Gap Fillers for Electronics - Electrolube ® LGF400 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Formulations - Applications - Ammunition Sealant - External Ammo Sealant 76040 - 37604060 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details