MLC capacitors with silver/palladium (Ag/Pd) terminations have often been used in medical applications where non-magnetic components are required, for example in MRI equipment - however, conventional nickel barrier terminations are not suitable due to their magnetic properties. In addition, RoHS requirement to use lead-free solders would cause an increase in soldering temperatures and cause solder leaching problems for the Ag/Pd termination. This has meant alternatives have had to be found and one solution is to use a copper barrier instead of a nickel barrier, with a tin finish on top. This nonmagnetic termination is offered with selected non-magnetic C0G/ NP0, High Q and X7R dielectrics, providing a fully non-magnetic component (µr = 1.0000). To meet high temperature 260ºC soldering reflow profiles as detailed in J-STD-020, C0G/NP0 dielectrics are supplied with FlexiCap™ or sintered termination whilst X7R dielectrics are supplied only with the FlexiCap™ termination.

A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability.

They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected to ascertain conformance to strict performance criteria. Units may be tested in accordance with MIL-PRF-55681, MIL-PRF-123, MIL-PRF-49467 or customer SCD. Designed for surface mount application with nickel barrier terminations making them suitable for solder wave and reflow solder board attachment as well as vapor phase attachment for part sizes 2225 or smaller. Silver-palladium terminations are also available for hybrid use with conductive epoxy. Class II X7R chips are used as decoupling, by-pass, filtering and transient voltage suppression elements and exhibit +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage. They find application for High Reliability use such as medical implanted devices, aerospace, airborne and military use as well as consumer uses requiring safety margins not attainable with commercial products.

Cap-Rack Capacitor Assemblies

• The Cap-Rack (US Patent 6,058,004) is an assembly of individual chip capacitors, bonded with high temperature epoxy.
• A Cap-Rack can be made up of a pair, to as many as eight same size chips - 0603,0805,1005,1206,1210,1808,1812,1825,2221 and 2225 - into one single component providing extended freedom for PCB space utilization.
• Footprint dimensions can also vary to further optimize board space usage.
• The patented design allows the chip to behave as individual components, not as a single large ceramic mass, and therefore reduces harmful thermal stress during assembly.
• Typical applications are in Multi-line designs, Mobile phones, Automotive, Computers, Network Devices and Medical products.
• Electrical advantages include reduction in cross talk, to insignificant levels, by elimination of capacitance coupling between adjacent capacitors; the ability to combine resistors and inductors within the Cap-Rack, as well as mixing and matching capacitance values and dielectrics.
• Mechanical advantages include reduced board area; easier to handle; reduced placement cost; reduces components stress and decreased cycle time.
• Cap-Rack can also be used with traditional pick and place equipment.
• Contact our sales team for High Reliability versions and custom designs, particularly for high voltage applications.
• Cap Arrays require drawings to specify length and width of array and chip size used. Please contact our sales team for details.

With AEC-Q200 approved ranges up to a voltage rating of 1kV we provide for the requirements of modern automotive applications including EV and HEV.

Ranges include :

1. Standard MLCCs
2. StackiCap™ - large capacitance/small case size MLCCs
3. Open Mode and Tandem capacitors
4. 3 terminal EMI components
5. X2Y Integrated Passive Component
6. X8R high temperature MLCCs
7. Safety Certified MLCCs

This range uses High Q and X7R dielectrics and provides a fully non-magnetic component (µr = 1.0000).

MLC capacitors with silver/palladium (Ag/Pd) terminations have often been used in medical applications where non-magnetic components are required, for example in MRI equipment - however, conventional nickel barrier terminations are not suitable due to their magnetic properties. In addition, RoHS requirement to use lead-free solders would cause an increase in soldering temperatures and cause solder leaching problems for the Ag/Pd termination. This has meant alternatives have had to be found and one solution is to use a copper barrier instead of a nickel barrier, with a tin finish on top. This nonmagnetic termination is offered with selected non-magnetic C0G/ NP0, High Q and X7R dielectrics, providing a fully non-magnetic component (µr = 1.0000). To meet high temperature 260ºC soldering reflow profiles as detailed in J-STD-020, C0G/NP0 dielectrics are supplied with FlexiCap™ or sintered termination whilst X7R dielectrics are supplied only with the FlexiCap™ termination.

Knowles Precision Devices produces a wide range of dipped radial leaded capacitors. These are available in rated voltages of 50V up to 6kV. Although our catalog range extends to 6kV, we are able to offer a capability for specials up to 12kV. Our larger case sizes and high voltage versions are particularly in demand, especially for mil/aero and medical power supply applications. Please contact the Sales Office to discuss any special requirements.

• High working voltage - up to 12kVdc
• Large case sizes
• RoHS compliant versions
• Tin-lead plated wire option to reduce tin whiskers (quote suffix A97 for 8111 to 8141 & A31 for 8151, 8161, 8171).