Applied to mask gold fingers, tab areas and other sections of printed circuit boards (PBCs) during the hot air leveling process. The silicone adhesive is specially formulated to hold down and protect the gold fingers during rigorous HAL operations yet remove cleanly from the board without splitting or leaving adhesive residue. A proven mask in double wrap applications.
Product Features
Temperature Rating: 480° F/ 250° C in 5 seconds
Prevents plating solution undercutting
Stands up to multiple operating cycles
Reduces rework
Excellent temperature and chemical resistance
No adhesive residue even after long delay in removal after wave soldering
Construction
1 Mil Polyester Film
6 Mil Crepe Paper
11 Mil Total Thickness
Roll Length - 36 yards
Specifications
Tensile Strength (lb/in) - 56
Elongation (%) - 5
Steel Adhesion (oz/in) - 53
Applied to mask gold fingers, tab areas and other sections of printed circuit boards (PBCs) during the hot air leveling process. The silicone adhesive is specially formulated to hold down and protect the gold fingers during rigorous HAL operations yet remove cleanly from the board without splitting or leaving adhesive residue. A proven mask in double wrap applications.
Product Features
- Temperature Rating: 480° F/ 250° C in 5 seconds
- Prevents plating solution undercutting
- Stands up to multiple operating cycles
- Reduces rework
- Excellent temperature and chemical resistance
- No adhesive residue even after long delay in removal after wave soldering
Construction
- 1 Mil Polyester Film
- 6 Mil Crepe Paper
- 11 Mil Total Thickness
- Roll Length - 36 yards
Specifications
- Tensile Strength (lb/in) - 56
- Elongation (%) - 5
- Steel Adhesion (oz/in) - 53
