CSP Technologies Activ-FilmTM materials enhance product stability in ways that are invisible to consumers and more efficient for manufacturers.
The flexible materials are ideal for use in applications like foil pouches, stick packs and blister packs in industries such as Pharmaceutical, Diagnostic, Food, Electronics and Optics.
Flexible film formats
Activ-FilmTM materials are available in configurations like rolls, die cut pieces and adhesive-backed labels. Film thickness typically ranges from 0.3 to 1.2 mm, though CSP can customize configurations to meet a wide range of size, shape, and packaging automation requirements.
Activ-FilmTM formulations can absorb a variety of unwanted ingress agents, including moisture, oxygen and volatile organic compounds. Activ-FilmTM materials can also expel gasses such as carbon dioxide (CO2), anti-microbial agents and other aroma-causing elements.
Formulated for performance, CSP’s range of Activ-FilmTM materials can be tailored to meet specific requirements.
CSP Technologies Activ-FilmTM materials enhance product stability in ways that are invisible to consumers and more efficient for manufacturers.
The flexible materials are ideal for use in applications like foil pouches, stick packs and blister packs in industries such as Pharmaceutical, Diagnostic, Food, Electronics and Optics.
Flexible film formats
Activ-FilmTM materials are available in configurations like rolls, die cut pieces and adhesive-backed labels. Film thickness typically ranges from 0.3 to 1.2 mm, though CSP can customize configurations to meet a wide range of size, shape, and packaging automation requirements.
Activ-FilmTM formulations can absorb a variety of unwanted ingress agents, including moisture, oxygen and volatile organic compounds. Activ-FilmTM materials can also expel gasses such as carbon dioxide (CO2), anti-microbial agents and other aroma-causing elements.
Formulated for performance, CSP’s range of Activ-FilmTM materials can be tailored to meet specific requirements.
