CSP Technologies, Inc. Activ-Blister™ Solutions

CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines. Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size. CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.