CSA Group Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues ISO 9455-17:2002

Description
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
  • Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues - ISO 9455-17:2002 - CSA Group
    CSA Group
Description
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

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Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues - ISO 9455-17:2002 - CSA Group
CSA Group
Toronto, Ontario, Canada
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
ISO 9455-17:2002
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues ISO 9455-17:2002
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number ISO 9455-17:2002
Product Name Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
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