CSA Group Device embedded substrate - Part 2-1: Guidelines - General description of technology IEC TS 62878-2-1:2015

Description
IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
Description
IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

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Device embedded substrate - Part 2-1: Guidelines - General description of technology - IEC TS 62878-2-1:2015 - CSA Group
Toronto, Ontario, Canada
Device embedded substrate - Part 2-1: Guidelines - General description of technology
IEC TS 62878-2-1:2015
Device embedded substrate - Part 2-1: Guidelines - General description of technology IEC TS 62878-2-1:2015
IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC TS 62878-2-1:2015
Product Name Device embedded substrate - Part 2-1: Guidelines - General description of technology
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