CSA Group Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing IEC TR 62866:2014

Description
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Description
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing - IEC TR 62866:2014 - CSA Group
Toronto, Ontario, Canada
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing IEC TR 62866:2014
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC TR 62866:2014
Product Name Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
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