CSA Group Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials IEC 62047-21:2014

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IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechani cal systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.
Description
IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechani cal systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

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Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials - IEC 62047-21:2014 - CSA Group
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Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
IEC 62047-21:2014
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials IEC 62047-21:2014
IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechani cal systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 62047-21:2014
Product Name Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
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