Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 61192-3:2002 |
| Product Name | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
