Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 61192-2:2003 |
| Product Name | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
