CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) IEC 60749-32:2002

Description
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.
  • Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) - IEC 60749-32:2002 - CSA Group
    CSA Group
Description
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

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Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) - IEC 60749-32:2002 - CSA Group
CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2002
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) IEC 60749-32:2002
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. The contents of the corrigendum of August 2003 have been included in this copy.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-32:2002
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
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