CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) IEC 60749-31:2002

Description
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.
Description
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.

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Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) - IEC 60749-31:2002 - CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-31:2002
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) IEC 60749-31:2002
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of the corrigendum of August 2003 have been included in this copy.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-31:2002
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
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