CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test IEC 60749-29:2011

Description
IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include: - a number of minor technical changes; - the addition of two new annexes covering the testing of special pins and temperature calculations.
Description
IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include: - a number of minor technical changes; - the addition of two new annexes covering the testing of special pins and temperature calculations.

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Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test - IEC 60749-29:2011 - CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-29:2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test IEC 60749-29:2011
IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include: - a number of minor technical changes; - the addition of two new annexes covering the testing of special pins and temperature calculations.

IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include:
- a number of minor technical changes;
- the addition of two new annexes covering the testing of special pins and temperature calculations.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-29:2011
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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