CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling IEC 60749-25:2003

Description
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
  • Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling - IEC 60749-25:2003 - CSA Group
    CSA Group
Description
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling - IEC 60749-25:2003 - CSA Group
CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling IEC 60749-25:2003
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-25:2003
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
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