This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 60749-23:2004 |
| Product Name | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
