Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 60749-22:2002 |
| Product Name | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
