Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 60749-16:2003 |
| Product Name | Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) |
