CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) IEC 60749-14:2003

Description
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
  • Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) - IEC 60749-14:2003 - CSA Group
    CSA Group
Description
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) - IEC 60749-14:2003 - CSA Group
CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) IEC 60749-14:2003
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-14:2003
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
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