CSA Group Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock IEC 60749-10:2002

Description
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.
Description
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.

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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - IEC 60749-10:2002 - CSA Group
Toronto, Ontario, Canada
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-10:2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock IEC 60749-10:2002
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages. The contents of the corrigendum of August 2003 have been included in this copy.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60749-10:2002
Product Name Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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