CSA Group Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits IEC 60748-20:1988

Description
Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.
Description
Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.

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Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - IEC 60748-20:1988 - CSA Group
Toronto, Ontario, Canada
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
IEC 60748-20:1988
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits IEC 60748-20:1988
Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.

Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.

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Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60748-20:1988
Product Name Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
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