CSA Group Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packag... IEC 60191-6-4:2003

Description

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

CSA Group

Description

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Suppliers

Company

Product

Description

Supplier Links

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packag... - IEC 60191-6-4:2003 - CSA Group

CSA Group

Toronto, Ontario, Canada

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packag...
IEC 60191-6-4:2003

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Supplier's Site

Technical Specifications

	CSA Group
Product Category	Standards and Technical Documents
Product Number	IEC 60191-6-4:2003
Product Name	Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packag...