CSA Group Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 60068-2-83:2011

Description
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
  • Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste - IEC 60068-2-83:2011 - CSA Group
    CSA Group
Description
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Suppliers

Company
Product
Description
Supplier Links
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste - IEC 60068-2-83:2011 - CSA Group
CSA Group
Toronto, Ontario, Canada
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste IEC 60068-2-83:2011
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Supplier's Site

Technical Specifications

  CSA Group
Product Category Standards and Technical Documents
Product Number IEC 60068-2-83:2011
Product Name Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Unlock Full Specs
to access all available technical data

Similar Products