CoorsTek Vacuum Break Filters for Semiconductor Deposition Processes

Description
Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides custom engineered OEM components for: Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Electrochemical Plating / Electrochemical Deposition (ECP, ECD) Atomic Layer Deposition (ALD) VACUUM BREAK FILTERS Vacuum break filters are diffusers used in deposition and other vacuum processes to enable quick, clean venting of vacuum chambers: Reduce particle adders on wafers for higher yield Speed chamber venting for higher throughput CoorsTek vacuum break filters use porous alumina (Al2O3) and porous silicon carbide (SiC) ceramics specifically engineered for various types and sizes of vacuum chambers: Tube type (for load-lock, transfer, and process chambers) Disk type (for narrow space chambers) Quartz type (for thermal processing and LPCVD chambers) RECOMMENDED DEPOSITION CHAMBER COMPONENT MATERIALS CoorsTek uses a broad portfolio of semiconductor grade ceramics including: Aluminas (Al2O3): PlasmaPure™, Sapphal™, and other high-purity compositions Aluminum Nitride (AlN) PureSiC® Silicon Carbide (SiC) Coatings: CVD SiC, ESD-Safe, Yttria
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Vacuum Break Filters for Semiconductor Deposition Processes -  - CoorsTek
Golden, CO, USA
Vacuum Break Filters for Semiconductor Deposition Processes
Vacuum Break Filters for Semiconductor Deposition Processes
Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. CoorsTek provides custom engineered OEM components for: Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Electrochemical Plating / Electrochemical Deposition (ECP, ECD) Atomic Layer Deposition (ALD) VACUUM BREAK FILTERS Vacuum break filters are diffusers used in deposition and other vacuum processes to enable quick, clean venting of vacuum chambers: Reduce particle adders on wafers for higher yield Speed chamber venting for higher throughput CoorsTek vacuum break filters use porous alumina (Al2O3) and porous silicon carbide (SiC) ceramics specifically engineered for various types and sizes of vacuum chambers: Tube type (for load-lock, transfer, and process chambers) Disk type (for narrow space chambers) Quartz type (for thermal processing and LPCVD chambers) RECOMMENDED DEPOSITION CHAMBER COMPONENT MATERIALS CoorsTek uses a broad portfolio of semiconductor grade ceramics including: Aluminas (Al2O3): PlasmaPure™, Sapphal™, and other high-purity compositions Aluminum Nitride (AlN) PureSiC® Silicon Carbide (SiC) Coatings: CVD SiC, ESD-Safe, Yttria

Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments.

CoorsTek provides custom engineered OEM components for:

  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)
  • Electrochemical Plating / Electrochemical Deposition (ECP, ECD)
  • Atomic Layer Deposition (ALD)

VACUUM BREAK FILTERS

Vacuum break filters are diffusers used in deposition and other vacuum processes to enable quick, clean venting of vacuum chambers:

  • Reduce particle adders on wafers for higher yield
  • Speed chamber venting for higher throughput

CoorsTek vacuum break filters use porous alumina (Al2O3) and porous silicon carbide (SiC) ceramics specifically engineered for various types and sizes of vacuum chambers:

  • Tube type (for load-lock, transfer, and process chambers)
  • Disk type (for narrow space chambers)
  • Quartz type (for thermal processing and LPCVD chambers)

RECOMMENDED DEPOSITION CHAMBER COMPONENT MATERIALS

CoorsTek uses a broad portfolio of semiconductor grade ceramics including:

  • Aluminas (Al2O3): PlasmaPure™, Sapphal™, and other high-purity compositions
  • Aluminum Nitride (AlN)
  • PureSiC® Silicon Carbide (SiC)
  • Coatings: CVD SiC, ESD-Safe, Yttria
Supplier's Site Datasheet

Technical Specifications

  CoorsTek
Product Category Filter Elements
Product Name Vacuum Break Filters for Semiconductor Deposition Processes
Application / Industry Semiconductor Deposition Processes
Unlock Full Specs
to access all available technical data

Similar Products

 - 512689 - RS Components, Ltd.
RS Components, Ltd.
Specs
Filtration Product HydraulicFluid
Filtration Grade 10.00 µm (0.3937 mils)
Flow Rate (Liquids) 83.2 GPM (315 L/min)
View Details
BIFOLD - Hydraulic Filters, F, BF -  - Rotork plc
Specs
Filtration Product HydraulicFluid
Flow Rate (Liquids) 10.6 GPM (40 L/min)
Maximum Pressure 7540 psi (5306 m H2O)
View Details
Waterproof and breathable aluminum foil for chemcial bottle -  - Shenzhen Milvent Technology Co., Limited
Specs
Application / Industry Chemical Bottle
Filtration Product Chemical
Filter Medium Material Metal Fiber
View Details
Liquid Line Sealed Model Filter-driers - Sporlan Catch-All® Series - C-052-FM - Parker Sporlan Division
Specs
Application / Industry Liquid Line
View Details