CoorsTek Paddles For Diffusion & LPCVD Equipment

Description
Cantilever paddles are used to position semiconductor wafer "boats" or carriers within process tubes, furnace reactors, and other thermal systems. Ceramic cantilever paddles insert and withdraw wafer carriers in process tubes with support only at one end. Longer paddles support higher wafer throughput in larger reactor, using ceramics such as silicon carbide (SiC) to provide the combination of high temperature strength, rigidity, and cleanliness required. Traditional diffusion, LPCVD (Low Pressure Chemical Vapor Deposition), and other batch semiconductor applications require the thermal and purity properties of advanced ceramics. Recommended Diffusion & LPCVD Materials TPSS, UltraClean™ Recrystallized Silicon Carbide PureSiC® CVD Silicon Carbide Coatings: CVD SiC Quartz
Description
Cantilever paddles are used to position semiconductor wafer "boats" or carriers within process tubes, furnace reactors, and other thermal systems. Ceramic cantilever paddles insert and withdraw wafer carriers in process tubes with support only at one end. Longer paddles support higher wafer throughput in larger reactor, using ceramics such as silicon carbide (SiC) to provide the combination of high temperature strength, rigidity, and cleanliness required. Traditional diffusion, LPCVD (Low Pressure Chemical Vapor Deposition), and other batch semiconductor applications require the thermal and purity properties of advanced ceramics. Recommended Diffusion & LPCVD Materials TPSS, UltraClean™ Recrystallized Silicon Carbide PureSiC® CVD Silicon Carbide Coatings: CVD SiC Quartz

Suppliers

Company
Product
Description
Supplier Links
Paddles For Diffusion & LPCVD Equipment -  - CoorsTek
Golden, CO, USA
Paddles For Diffusion & LPCVD Equipment
Paddles For Diffusion & LPCVD Equipment
Cantilever paddles are used to position semiconductor wafer "boats" or carriers within process tubes, furnace reactors, and other thermal systems. Ceramic cantilever paddles insert and withdraw wafer carriers in process tubes with support only at one end. Longer paddles support higher wafer throughput in larger reactor, using ceramics such as silicon carbide (SiC) to provide the combination of high temperature strength, rigidity, and cleanliness required. Traditional diffusion, LPCVD (Low Pressure Chemical Vapor Deposition), and other batch semiconductor applications require the thermal and purity properties of advanced ceramics. Recommended Diffusion & LPCVD Materials TPSS, UltraClean™ Recrystallized Silicon Carbide PureSiC® CVD Silicon Carbide Coatings: CVD SiC Quartz

Cantilever paddles are used to position semiconductor wafer "boats" or carriers within process tubes, furnace reactors, and other thermal systems. Ceramic cantilever paddles insert and withdraw wafer carriers in process tubes with support only at one end. Longer paddles support higher wafer throughput in larger reactor, using ceramics such as silicon carbide (SiC) to provide the combination of high temperature strength, rigidity, and cleanliness required.

Traditional diffusion, LPCVD (Low Pressure Chemical Vapor Deposition), and other batch semiconductor applications require the thermal and purity properties of advanced ceramics.

Recommended Diffusion & LPCVD Materials

  • TPSS, UltraClean™ Recrystallized Silicon Carbide
  • PureSiC® CVD Silicon Carbide
  • Coatings: CVD SiC
  • Quartz
Supplier's Site

Technical Specifications

  CoorsTek
Product Category Industrial Ceramic Materials
Product Name Paddles For Diffusion & LPCVD Equipment
Material Type Carbide Material; Silicon Carbide
Unlock Full Specs
to access all available technical data

Similar Products

Silicon Carbide Beam -  - Fountyl Technologies Pte. Ltd.
Fountyl Technologies Pte. Ltd.
Specs
Material Type Carbide Material; Silicon Carbide
View Details
99% Alumina round structure -  - Shenzhen Great Precision Ceramic CO., LTD.
Shenzhen Great Precision Ceramic CO., LTD.
Specs
Material Type Alumina
Applications HV / Electrical
View Details
SR600-10 Graphite Sheet - sr600-10graphitesheet - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Shape / Form Plate / Board
Thickness 0.0051 inch (0.1300 mm)
View Details
Piston/Sleeve Assemblies -  - Insaco, Inc.
Specs
Material Type Alumina; Sapphire
Shape / Form Custom Shape
View Details