Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge.
ADVANCED CERAMIC COMPONENTS
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.
EXAMPLE ETCH PROCESS MATERIALS
Plasma Pure™ UC Alumina
Low Loss Tangent Alumina
PureSiC® CVD Silicon Carbide
Exyria™ Yttria & Yttria Coatings
Coatings: CVD SiC, ESD-Safe
UltraClean™ Recrystallized SiC
StatSafe™ ESD-Safe Ceramics
Single Crystal Silicon
Focus/edge rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring - held in place by the electrostatic charge.
ADVANCED CERAMIC COMPONENTS
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.
EXAMPLE ETCH PROCESS MATERIALS
- Plasma Pure™ UC Alumina
- Low Loss Tangent Alumina
- PureSiC® CVD Silicon Carbide
- Exyria™ Yttria & Yttria Coatings
- Coatings: CVD SiC, ESD-Safe
- UltraClean™ Recrystallized SiC
- StatSafe™ ESD-Safe Ceramics
- Single Crystal Silicon
